TT Electronics/IRC

GUS-SS8B-02-1691-GD

GUS-SS8B-02-1691-GD Description

The GUS-SS8B-02-1691-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors with a 1.69KΩ resistance value, offering a tight 2% tolerance and a low ±50ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. The gull-wing termination and surface-mount design ensure easy integration into compact PCB layouts, while its 100V maximum voltage rating makes it suitable for moderate-voltage circuits.

GUS-SS8B-02-1691-GD Features

• Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• High Power Density: 0.8W total power rating (0.05W per resistor) in a small footprint.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for harsh environments.
• BUS Circuit Designator: Optimized for bus termination and pull-up/pull-down applications.
• Robust Construction: Gull-wing leads and surface-mount compatibility enhance mechanical reliability.

GUS-SS8B-02-1691-GD Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Precision voltage dividers, feedback networks.
• Bus Termination: DDR memory, CAN, and I²C interfaces.
• Industrial Electronics: PLCs, sensor interfaces, and control systems.
• Automotive (Non-Automotive Rated): Infotainment, lighting, and non-safety-critical circuits.
• Test & Measurement Equipment: Calibration circuits, reference networks.

Conclusion of GUS-SS8B-02-1691-GD

The GUS-SS8B-02-1691-GD combines high precision, compact design, and robust performance, making it a versatile choice for demanding electronic systems. Its thin-film technology and wide operating range cater to applications requiring stability under thermal stress, while the SOIC package ensures compatibility with automated assembly processes. Ideal for engineers seeking reliability in industrial, communication, and instrumentation designs.