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GUS-SS8B-02-1962-FF
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GUS-SS8B-02-1962-FF Description
GUS-SS8B-02-1962-FF Description
The GUS-SS8B-02-1962-FF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package features 15 resistors with a 19.6K Ohm resistance value, offering a tight 1% tolerance and a low ±50ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. The gull-wing termination and surface-mount design ensure easy integration into compact PCB layouts, while its 100V maximum voltage rating makes it suitable for robust circuit designs.
GUS-SS8B-02-1962-FF Features
- Precision Thin Film Technology: Delivers stable performance with low TCR (±50ppm/°C) and high accuracy (1% tolerance).
- Compact SOIC Package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
- High Power Handling: 0.8W total power rating (0.05W per resistor) for demanding applications.
- Wide Temperature Range: Operates from 70°C to 125°C, derated for consistent performance.
- Robust Construction: Gull-wing leads and surface-mount compatibility enhance durability and solderability.
- Non-Automotive, Non-PPAP: Ideal for industrial and commercial electronics where PPAP compliance is not required.
GUS-SS8B-02-1962-FF Applications
This resistor network excels in:
- Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces requiring stable resistance.
- Signal Conditioning: ADC/DAC reference circuits, filter networks, and impedance matching.
- Industrial Control Systems: PLCs, motor drives, and power management modules.
- Test & Measurement Equipment: Calibration circuits and instrumentation where low drift is critical.
- Consumer Electronics: Audio amplifiers, display drivers, and power supplies.
Conclusion of GUS-SS8B-02-1962-FF
The GUS-SS8B-02-1962-FF stands out for its precision, compact form factor, and robust performance in harsh environments. Its thin-film technology ensures long-term reliability, while the SOIC package simplifies high-density PCB assembly. Although not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, commercial, and precision electronic systems demanding tight tolerances and thermal stability. Engineers will appreciate its balance of power handling, accuracy, and space-saving design.



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