
TT Electronics/IRC
GUS-SS8B-02-2321-J
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GUS-SS8B-02-2321-J Description
GUS-SS8B-02-2321-J Description
The GUS-SS8B-02-2321-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 2.32KΩ resistance and a 5% tolerance, delivering reliable performance in compact surface-mount designs. With a 0.8W total power rating (0.05W per resistor) and a ±50ppm/°C temperature coefficient, it ensures stable operation across a wide temperature range (70°C to 125°C). The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB assembly, while its 100V maximum voltage rating makes it suitable for moderate-voltage circuits.
GUS-SS8B-02-2321-J Features
- Thin-film technology: Offers superior stability, low noise, and tight TCR (±50ppm/°C).
- Compact SOIC package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm height/length).
- High power density: 0.8W total dissipation in a small footprint, ideal for space-constrained designs.
- Automated assembly-friendly: Gull-wing leads and 1.27mm pitch ensure compatibility with SMD processes.
- Wide operating range: Rated for -55°C to +125°C, with derated power up to 125°C.
- Non-automotive, non-PPAP: Suited for industrial, telecom, and consumer electronics.
GUS-SS8B-02-2321-J Applications
- Signal conditioning: Precision voltage dividers in sensor interfaces.
- Analog/digital systems: Pull-up/pull-down networks in microcontrollers and FPGAs.
- Medical devices: Stable resistance in diagnostic equipment.
- Telecom infrastructure: Impedance matching in high-frequency circuits.
- Test & measurement: Calibration circuits requiring low TCR drift.
Conclusion of GUS-SS8B-02-2321-J
The GUS-SS8B-02-2321-J excels in precision, power efficiency, and miniaturization, making it a top choice for engineers needing reliable resistor networks in industrial and communication systems. Its thin-film construction and robust SOIC package provide a competitive edge over thicker-film alternatives, particularly in applications demanding thermal stability and compactness. While not RoHS-compliant, its performance metrics justify its use in specialized, non-consumer environments.



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