


TT Electronics/IRC
GUS-SS8B-02-2321-JD
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GUS-SS8B-02-2321-JD Description
GUS-SS8B-02-2321-JD Description
The GUS-SS8B-02-2321-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin SOIC device integrates 15 resistors with a 2.32K Ohm resistance value, offering a 5% tolerance and ±50ppm/°C temperature coefficient for stable operation across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it ensures reliable performance in compact, surface-mount designs. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while its 9.91mm x 5.99mm x 1.45mm footprint suits space-constrained layouts.
GUS-SS8B-02-2321-JD Features
- Thin-Film Technology: Delivers superior accuracy and stability compared to thick-film alternatives.
- Robust Construction: SOIC package with rectangular shape and ±0.1mm height tolerance ensures mechanical durability.
- High-Temperature Resilience: Operates reliably up to 125°C, ideal for industrial and automotive-adjacent applications (though not PPAP/Automotive certified).
- Low TCR: ±50ppm/°C minimizes resistance drift under thermal stress.
- Efficient Power Handling: 0.8W total dissipation balances performance and thermal management.
- Non-RoHS Compliance: Suitable for legacy or specialized systems where RoHS exemptions apply.
GUS-SS8B-02-2321-JD Applications
- Signal Conditioning: Precision voltage dividers in sensor interfaces.
- Analog Circuits: Feedback networks in op-amp configurations.
- Industrial Controls: PLCs and instrumentation requiring stable resistance under thermal cycling.
- Telecom Hardware: Impedance matching in high-frequency modules.
- Legacy Systems: Maintenance or upgrades for non-RoHS-compliant designs.
Conclusion of GUS-SS8B-02-2321-JD
The GUS-SS8B-02-2321-JD excels in precision, power efficiency, and thermal stability, making it a standout choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and tight tolerances address critical design challenges, while the SOIC gull-wing package simplifies manufacturing. Though not suited for automotive PPAP workflows, it remains a versatile solution for industrial, telecom, and legacy applications demanding robust performance.



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