TT Electronics/IRC

GUS-SS8B-02-3012-JD

GUS-SS8B-02-3012-JD Description

The GUS-SS8B-02-3012-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC device integrates 15 resistors, each with a 30.1KΩ resistance value and a 5% tolerance, ensuring reliable performance in compact circuit designs. With a ±50ppm/°C temperature coefficient, it maintains stability across a wide operating range of -70°C to +125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-02-3012-JD Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
• Compact SOIC Package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• High-Temperature Resilience: Operates reliably up to 125°C, ideal for industrial and automotive-adjacent applications (though not PPAP/Automotive certified).
• BUS Circuit Designator: Optimized for bus line termination and signal conditioning.
• Robust Power Handling: 0.8W total dissipation with derated performance at elevated temperatures.
• Non-RoHS Compliant: Suitable for legacy or exempted applications requiring specific material properties.

GUS-SS8B-02-3012-JD Applications

• Signal Conditioning: Precision voltage division in ADC/DAC circuits.
• Bus Termination: Effective impedance matching in data communication systems (e.g., CAN, SPI).
• Industrial Controls: Stable performance in PLCs, sensors, and power management modules.
• Test & Measurement Equipment: Low-drift resistance networks for calibration and instrumentation.
• Aerospace & Defense: Non-RoHS compliance may align with certain military specifications.

Conclusion of GUS-SS8B-02-3012-JD

The GUS-SS8B-02-3012-JD excels in space-constrained, high-reliability applications where thin-film accuracy and thermal resilience are critical. Its SOIC-16 package and BUS-oriented design offer a balance of density and performance, outperforming thicker-film networks in precision scenarios. While not suited for automotive PPAP workflows, it remains a robust choice for industrial, communications, and legacy systems requiring stable, low-TCR resistance arrays. Engineers will appreciate its repeatable performance and ease of integration in surface-mount assemblies.