TT Electronics/IRC

GUS-SS8B-02-3090-JF

GUS-SS8B-02-3090-JF Description

The GUS-SS8B-02-3090-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin SOIC package integrates 15 resistors, each with a 309Ω resistance value and a 5% tolerance, ensuring reliable signal conditioning and voltage division. With a ±50ppm/°C temperature coefficient, it maintains stable performance across a wide operating range of -70°C to +125°C, making it suitable for demanding environments. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating provide robust electrical characteristics, while the gull-wing termination ensures secure SMD mounting.

GUS-SS8B-02-3090-JF Features

• Thin-Film Technology: Delivers superior accuracy, low noise, and long-term stability compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth), ideal for space-constrained designs.
• High-Temperature Resilience: Rated for 125°C maximum operating temperature, suitable for industrial and automotive-adjacent applications (though not PPAP/automotive-certified).
• Optimized Power Distribution: 0.8W total dissipation (1/20W per resistor) balances performance and thermal management.
• Non-RoHS Compliant: May be preferred for legacy or specialized systems requiring leaded components.

GUS-SS8B-02-3090-JF Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces in test/measurement equipment.
• Signal Conditioning: DAC/ADC reference networks, gain-setting circuits in audio and instrumentation systems.
• Industrial Controls: PLCs, motor drives, and power supplies where temperature stability is critical.
• Telecom Infrastructure: Line termination and impedance matching in high-frequency modules.

Conclusion of GUS-SS8B-02-3090-JF

The GUS-SS8B-02-3090-JF excels in applications demanding tight resistance matching, thermal stability, and compact form factors. Its thin-film construction and SOIC gull-wing design offer a reliable alternative to discrete resistors, reducing board space and assembly complexity. While not suited for automotive use, it is a cost-effective solution for industrial, telecom, and precision electronics where moderate power handling and wide temperature operation are key. Engineers will appreciate its balance of performance, durability, and ease of integration.