TT Electronics/IRC

GUS-SS8B-02-3091-FF

GUS-SS8B-02-3091-FF Description

The GUS-SS8B-02-3091-FF from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 3.09K Ohm resistance value, offering 1% tolerance and a ±50ppm/°C temperature coefficient for stable performance across a wide operating range of 70°C to 125°C. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it ensures reliability in compact, high-density circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB assembly, while its rectangular SOIC package (9.91mm x 5.99mm x 1.45mm) adheres to tight dimensional tolerances (±0.1mm height, ±0.2mm depth).

GUS-SS8B-02-3091-FF Features

• Precision Thin Film Technology: Delivers low noise and high stability, ideal for analog signal conditioning.
• BUS Circuit Designator: Optimized for bus line termination and pull-up/pull-down applications.
• Robust Power Handling: 0.8W total dissipation (1/20W per resistor) at 125°C maximum temperature.
• Surface-Mount Gull Wing Terminals: Ensures secure soldering and mechanical durability.
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial electronics (excludes automotive PPAP requirements).
• Tube Packaging: Protects components during shipping and handling.

GUS-SS8B-02-3091-FF Applications

This resistor network excels in:

• Voltage Division & Signal Conditioning: Precision dividers in ADC/DAC circuits.
• Bus Termination & Pull-Up Networks: Ensures signal integrity in digital communication systems (e.g., I²C, SPI).
• Industrial Control Systems: Stable performance in PLCs, sensors, and instrumentation.
• Medical Electronics: Reliable operation in diagnostic equipment where low drift is critical.
• Consumer Electronics: Compact solutions for audio/video processing and power management.

Conclusion of GUS-SS8B-02-3091-FF

The GUS-SS8B-02-3091-FF combines high precision, compact form factor, and robust power handling, making it a superior choice for engineers designing dense, high-reliability circuits. Its thin-film technology and tight tolerances outperform bulkier or less stable alternatives, while the SOIC-16 package simplifies integration. Though not RoHS-compliant, it remains a go-to for non-regulated industrial and commercial applications requiring consistent performance under thermal stress.