TT Electronics/IRC

GUS-SS8B-02-3092-GD

GUS-SS8B-02-3092-GD Description

The GUS-SS8B-02-3092-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. It features 15 resistors in a 16-pin SOIC package with a 30.9KΩ resistance value, 2% tolerance, and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). The device offers a 0.8W total power rating (0.05W per resistor) and supports a maximum voltage rating of 100V, making it suitable for demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-02-3092-GD Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm length/height, ±0.2mm depth) save board space.
• Robust Performance: Operates up to 125°C with derated power handling, ideal for industrial environments.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Non-Automotive, Non-PPAP: Suitable for commercial and industrial use where PPAP compliance isn’t required.
• 16-Pin Gull Wing SMD: Ensures reliable solder joints and mechanical stability in high-vibration settings.

GUS-SS8B-02-3092-GD Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Bus Termination: DDR memory lines, CAN buses, and other high-speed digital interfaces.
• Industrial Controls: PLCs, sensor interfaces, and power management systems requiring stable resistance.
• Test & Measurement Equipment: Calibration circuits and reference networks demanding low TCR.
• Consumer Electronics: Audio amplifiers and display drivers where space and reliability are critical.

Conclusion of GUS-SS8B-02-3092-GD

The GUS-SS8B-02-3092-GD combines high precision, compact design, and thermal resilience, making it a superior choice for engineers prioritizing accuracy and durability. Its thin-film technology and SOIC package offer a competitive edge over thicker-film or bulkier alternatives, particularly in space-constrained or thermally challenging designs. While not RoHS-compliant, its performance in industrial and commercial applications justifies its selection for critical circuits.