TT Electronics/IRC

GUS-SS8B-02-3160-FD

GUS-SS8B-02-3160-FD Description

The GUS-SS8B-02-3160-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. Encased in a 16-pin SOIC package with gull-wing terminations, this device integrates 15 resistors with a uniform 316Ω resistance and tight 1% tolerance, ensuring consistent performance in precision circuits. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The network delivers a total power rating of 0.8W (0.05W per resistor), supporting robust operation in compact designs. With a 100V maximum voltage rating and non-automotive PPAP compliance, it targets industrial and instrumentation use.

GUS-SS8B-02-3160-FD Features

• Circuit Designator: BUS configuration for streamlined integration.
• Thin-Film Technology: Delivers low noise and high stability (±50ppm/°C).
• Precision Tolerance: 1% resistance accuracy for critical applications.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm (L×D×H) with ±0.1mm dimensional tolerances.
• High Power Density: 0.8W total dissipation (0.05W/resistor) in a minimal footprint.
• Wide Voltage Range: Supports up to 100V, ideal for signal conditioning and divider networks.
• Non-RoHS: Suitable for legacy or specialized systems requiring leaded components.

GUS-SS8B-02-3160-FD Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces.
• Industrial Control Systems: PLCs, motor drives, and power management modules.
• Test & Measurement Equipment: Calibration tools and data acquisition systems.
• Telecommunications: Signal processing and impedance matching in RF stages.
• Legacy Electronics: Upgrades or repairs of non-RoHS-compliant designs.

Conclusion of GUS-SS8B-02-3160-FD

The GUS-SS8B-02-3160-FD combines high precision, thermal resilience, and compact design, making it a superior choice for engineers needing reliable resistor networks in space-constrained, thermally variable environments. Its thin-film construction and strict tolerances outperform thicker-film alternatives in stability-critical applications, while the SOIC package ensures compatibility with automated assembly processes. Ideal for industrial and instrumentation markets, this model balances performance with cost-effectiveness for mid-to-high-volume production.