TT Electronics/IRC

GUS-SS8B-02-3240-FD

GUS-SS8B-02-3240-FD Description

The GUS-SS8B-02-3240-FD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package features 15 resistors with a 324Ω resistance value, 1% tolerance, and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this component is engineered for reliability in demanding circuits. Its gull-wing termination and surface-mount design facilitate easy integration into compact PCB layouts. The SOIC package offers a compact footprint (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth), making it ideal for space-constrained designs.

GUS-SS8B-02-3240-FD Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• High Power Density: 0.8W total dissipation (0.05W per resistor) in a compact SOIC-16 package.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
• Strict Tolerances: 1% resistance tolerance and ±50ppm/°C TCR ensure consistent performance.
• Robust Construction: Gull-wing SMD termination enhances mechanical durability and solderability.
• Automotive-Grade Alternatives: While not automotive-qualified (PPAP: No), its performance suits industrial and telecom applications.

GUS-SS8B-02-3240-FD Applications

• Voltage Division/Current Sensing: Ideal for precision dividers in ADC/DAC circuits.
• Signal Conditioning: Used in op-amp feedback networks and filter designs.
• Industrial Controls: Reliable performance in PLCs, motor drives, and power supplies.
• Telecom Infrastructure: Stable operation in baseband processing and RF modules.
• Test & Measurement Equipment: Low TCR minimizes drift in calibration circuits.

Conclusion of GUS-SS8B-02-3240-FD

The GUS-SS8B-02-3240-FD excels in precision, power efficiency, and compactness, making it a standout choice for high-density PCB designs requiring stable resistance networks. Its thin-film technology and tight tolerances cater to applications demanding long-term reliability under thermal stress. While not RoHS-compliant or automotive-rated, it remains a robust solution for industrial, telecom, and instrumentation markets. Engineers will appreciate its balance of performance and space-saving packaging, reducing BOM complexity without compromising quality.