TT Electronics/IRC

GUS-SS8B-02-3300-JF

GUS-SS8B-02-3300-JF Description

The GUS-SS8B-02-3300-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin SOIC package integrates 15 resistors, each with a 330Ω resistance value and a 5% tolerance, offering a compact and reliable solution for signal conditioning, voltage division, and pull-up/down circuits. With a 0.8W total power rating (0.05W per resistor) and a ±50ppm/°C temperature coefficient, it ensures stable performance across a wide temperature range of -70°C to +125°C. The gull-wing termination and 1.27mm terminal pitch facilitate easy soldering and high-density layouts.

GUS-SS8B-02-3300-JF Features

• Thin-Film Technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
• High Power Density: 0.8W total dissipation in a compact 9.91mm × 5.99mm × 1.45mm footprint.
• Robust Construction: SOIC package with ±0.1mm length/height tolerances ensures mechanical reliability.
• Broad Voltage Rating: Supports up to 100V, making it suitable for industrial and telecom applications.
• Non-Automotive Grade: Ideal for commercial and industrial electronics where PPAP compliance is not required.
• Tube Packaging: Protects components during handling and assembly.

GUS-SS8B-02-3300-JF Applications

This resistor network excels in:

• Analog Signal Processing: Precision dividers in sensor interfaces or ADC/DAC circuits.
• Digital Systems: Pull-up/down networks for microcontrollers and FPGAs.
• Power Management: Current-limiting or biasing in low-power DC/DC converters.
• Test & Measurement Equipment: Stable reference networks due to low TCR (±50ppm/°C).
• Industrial Controls: Durable performance in harsh environments (up to 125°C).

Conclusion of GUS-SS8B-02-3300-JF

The GUS-SS8B-02-3300-JF combines high-density integration, thin-film precision, and robust thermal performance, making it a versatile choice for engineers prioritizing reliability in space-constrained designs. Its non-automotive and non-PPAP status suits cost-sensitive commercial applications, while the gull-wing SMD termination ensures compatibility with standard reflow processes. For designs demanding stable resistance values under thermal stress, this network offers a balanced blend of performance and affordability.