TT Electronics/IRC

GUS-SS8B-02-3301-GF

GUS-SS8B-02-3301-GF Description

The GUS-SS8B-02-3301-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC device integrates 15 resistors, each with a 3.3KΩ resistance and a tight 2% tolerance, ensuring reliable signal conditioning and voltage division. With a ±50ppm/°C temperature coefficient, it delivers stable performance across a wide temperature range (70°C to 125°C). The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and surface-mount design enable seamless integration into compact PCB layouts.

GUS-SS8B-02-3301-GF Features

• Precision Thin Film Technology: Ensures low noise and high stability.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height, ±0.2mm depth).
• High Power Handling: 0.8W total dissipation (0.05W per resistor) at 125°C maximum operating temperature.
• BUS Circuit Designator: Optimized for bus line termination and pull-up/down applications.
• Robust Construction: Gull-wing leads with 1.27mm pitch for reliable soldering and mechanical strength.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial electronics.

GUS-SS8B-02-3301-GF Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and feedback networks in analog circuits.
• Bus Termination: DDR memory lines, CAN bus, and other high-speed digital interfaces.
• Embedded Systems: Pull-up/down resistors for microcontrollers and FPGAs.
• Test & Measurement Equipment: Stable reference networks for accurate sensing.
• Power Management: Current limiting and load balancing in low-power DC/DC converters.

Conclusion of GUS-SS8B-02-3301-GF

The GUS-SS8B-02-3301-GF combines precision, compactness, and reliability, making it a top choice for engineers designing high-density, high-performance electronics. Its thin-film technology, tight tolerances, and robust package address challenges in signal integrity, thermal management, and space constraints. While not suited for automotive use, it is a cost-effective solution for industrial, telecom, and consumer applications requiring stable resistance networks.