TT Electronics/IRC

GUS-SS8B-02-3401-JF

GUS-SS8B-02-3401-JF Description

The GUS-SS8B-02-3401-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin SOIC package integrates 15 resistors, each with a 3.4KΩ resistance value and a 5% tolerance, ensuring stable performance across a wide temperature range of 70°C to 125°C. With a ±50ppm/°C temperature coefficient, it delivers excellent thermal stability, while its 0.8W total power rating (0.05W per resistor) supports robust operation in compact designs. The gull-wing termination and 1.27mm terminal pitch facilitate reliable soldering, making it ideal for automated assembly processes.

GUS-SS8B-02-3401-JF Features

• Thin-Film Technology: Ensures low noise, high accuracy, and superior long-term stability compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth), optimizing board space.
• High Voltage Rating: Supports up to 100V, suitable for industrial and instrumentation circuits.
• Wide Temperature Range: Operates reliably from -55°C to +125°C (derated power up to 125°C).
• Automated Assembly-Friendly: Gull-wing leads and 1.27mm pitch ensure compatibility with pick-and-place systems.
• Non-Automotive/Non-PPAP: Ideal for commercial and industrial applications where PPAP compliance is not required.

GUS-SS8B-02-3401-JF Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning in test/measurement equipment.
• Signal Processing: DAC/ADC reference networks, filter networks, and impedance matching.
• Industrial Controls: PLCs, motor drives, and power management systems requiring stable resistance under thermal stress.
• Consumer Electronics: Audio amplifiers, display drivers, and power supplies where space efficiency is critical.

Conclusion of GUS-SS8B-02-3401-JF

The GUS-SS8B-02-3401-JF combines thin-film precision, compact form factor, and high power density, making it a standout choice for engineers prioritizing reliability in constrained layouts. Its broad temperature range and low TCR cater to demanding environments, while the SOIC-16 package ensures compatibility with standard SMD workflows. Though not RoHS-compliant, its performance metrics position it as a cost-effective solution for non-automotive, high-accuracy applications.