TT Electronics/IRC

GUS-SS8B-02-3601-J

GUS-SS8B-02-3601-J Description

The GUS-SS8B-02-3601-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 3.6KΩ resistance, 5% tolerance, and a ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a maximum voltage rating of 100V, this component is engineered for reliability in demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-02-3601-J Features

• Precision Thin Film Technology: Delivers low noise and high stability, ideal for sensitive analog circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• Robust Power Handling: 0.8W total dissipation with derated performance up to 125°C.
• BUS Circuit Designator: Optimized for bus line termination, reducing signal reflection in high-speed digital systems.
• Non-Automotive, Non-PPAP: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance is not required.
• Non-RoHS: Note for applications exempt from RoHS restrictions.

GUS-SS8B-02-3601-J Applications

• Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Bus Termination: Effective impedance matching in CAN, SPI, or I²C interfaces to minimize signal integrity issues.
• Industrial Controls: Stable performance in PLCs, sensor interfaces, and power management systems.
• Test & Measurement Equipment: Low-drift resistance networks for calibration and reference circuits.
• Telecom Infrastructure: Reliable operation in baseband processing and line driver modules.

Conclusion of GUS-SS8B-02-3601-J

The GUS-SS8B-02-3601-J excels in precision, power efficiency, and compactness, making it a superior choice for high-density PCB designs requiring stable resistive networks. Its thin-film construction and wide operating temperature range outperform carbon or thick-film alternatives in critical environments. While not RoHS-compliant, it remains ideal for industrial and telecom systems where durability and signal fidelity are paramount. Engineers will appreciate its balance of performance, size, and cost in complex circuit architectures.