TT Electronics/IRC

GUS-SS8B-02-3602-JD

GUS-SS8B-02-3602-JD Description

The GUS-SS8B-02-3602-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 36K Ohm resistance and a 5% tolerance, delivering stable performance across a wide temperature range (70°C to 125°C). With a ±50ppm/°C temperature coefficient, it ensures minimal resistance drift under thermal stress. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-02-3602-JD Features

• Precision Thin Film Technology: Offers superior stability and low noise compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Density: 0.8W total dissipation (0.05W per resistor) in a minimal footprint.
• Wide Operating Range: Functions reliably from -55°C to +125°C (derated power up to 125°C).
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its robustness suits industrial and telecom applications.
• Non-RoHS Compliance: Ideal for legacy systems requiring leaded components.

GUS-SS8B-02-3602-JD Applications

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Control Systems: Stable bias networks for PLCs and motor drivers.
• Telecommunications: Impedance matching in RF modules and base stations.
• Test & Measurement Equipment: Low-drift reference circuits for multimeters and oscilloscopes.
• Legacy Electronics Repair: Direct replacement for non-RoHS compliant designs.

Conclusion of GUS-SS8B-02-3602-JD

The GUS-SS8B-02-3602-JD excels in precision, power efficiency, and compactness, making it a top choice for engineers needing reliable resistor networks in space-constrained, high-temperature environments. Its thin-film construction and tight tolerances outperform generic arrays, while the SOIC gull-wing package simplifies assembly. Though not suited for automotive use, it remains a cost-effective solution for industrial, telecom, and instrumentation applications demanding long-term stability.