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GUS-SS8B-02-4702-GF
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GUS-SS8B-02-4702-GF Description
GUS-SS8B-02-4702-GF Description
The GUS-SS8B-02-4702-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC (Small Outline Integrated Circuit) package features 15 resistors with a 47K Ohm resistance value and a tight 2% tolerance, ensuring reliable signal conditioning and voltage division. With a ±50ppm/°C temperature coefficient, it delivers stable performance across a wide operating temperature range of 70°C to 125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination ensures secure surface-mount (SMD) assembly, while the tube packaging facilitates automated handling.
GUS-SS8B-02-4702-GF Features
- Precision Thin Film Technology: Offers low noise and high stability for sensitive analog/digital circuits.
- Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm length/height).
- High Power Density: 0.8W total dissipation in a small footprint, ideal for space-constrained designs.
- Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power.
- Robust Construction: Gull-wing leads provide mechanical strength and solderability.
- Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation applications.
GUS-SS8B-02-4702-GF Applications
This resistor network excels in:
- Analog Signal Processing: Voltage dividers, DAC/ADC reference circuits.
- Industrial Control Systems: PLCs, sensor interfaces requiring stable resistance.
- Telecommunications: Line termination, impedance matching in RF modules.
- Test & Measurement Equipment: Precision calibration networks.
- Power Management: Feedback networks in DC-DC converters.
Conclusion of GUS-SS8B-02-4702-GF
The GUS-SS8B-02-4702-GF combines precision, power efficiency, and compactness, making it a superior choice for engineers needing reliable resistor networks in harsh environments. Its thin-film technology and SOIC packaging offer a competitive edge over bulkier or less stable alternatives. While not RoHS-compliant, it remains ideal for industrial and telecom systems where performance outweighs regulatory constraints.



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