TT Electronics/IRC

GUS-SS8B-02-4750-D

GUS-SS8B-02-4750-D Description

The GUS-SS8B-02-4750-D from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors, each with a 475Ω resistance value and an ultra-tight 0.5% tolerance, ensuring exceptional accuracy in circuit designs. With a ±50ppm/°C temperature coefficient, it delivers stable performance across a wide temperature range (70°C to 125°C). The network supports a maximum voltage rating of 100V and a total power rating of 0.8W (0.05W per resistor), making it suitable for precision analog and digital systems. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB mounting.

GUS-SS8B-02-4750-D Features

• Precision Thin Film Technology: Ensures low noise, high stability, and minimal drift over time.
• Compact SOIC Package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• High Power Density: 0.8W total power dissipation in a small footprint, ideal for space-constrained designs.
• Automotive-Grade Alternatives: While not automotive-qualified (PPAP: No), its performance rivals higher-cost options.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring traditional materials.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down networks.

GUS-SS8B-02-4750-D Applications

This resistor network excels in:

• Precision Instrumentation: ADC/DAC reference circuits, sensor signal conditioning.
• Communication Systems: Impedance matching and termination in high-speed data lines.
• Industrial Controls: PLCs, motor drives, and power management modules requiring stable resistance.
• Medical Electronics: Low-drift circuits in diagnostic equipment.
• Legacy Military/Aerospace: Non-RoHS compliance aligns with certain defense specifications.

Conclusion of GUS-SS8B-02-4750-D

The GUS-SS8B-02-4750-D combines high accuracy, robust power handling, and compact design, making it a standout choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and tight tolerances outperform generic thick-film networks, while the SOIC package ensures compatibility with automated assembly. Ideal for precision analog circuits and high-density PCBs, this model balances performance with cost-effectiveness for industrial and communication applications.