TT Electronics/IRC

GUS-SS8B-02-6491-FF

GUS-SS8B-02-6491-FF Description

The GUS-SS8B-02-6491-FF from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors, each with a 6.49KΩ resistance value and a tight 1% tolerance, ensuring reliable performance in precision circuits. With a ±50ppm/°C temperature coefficient, it maintains stability across a wide operating temperature range of 70°C to 125°C, derated for optimal power handling. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for low-power, high-voltage environments. Its gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GUS-SS8B-02-6491-FF Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length, ±0.2mm depth) ensure space-efficient designs.
• High Power Density: 0.8W total dissipation in a small footprint, ideal for densely populated boards.
• Wide Temperature Range: Operates reliably up to 125°C, with derated performance up to 70°C.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its robustness suits industrial and telecom applications.
• Non-RoHS Compliance: Note: Not compliant with EU RoHS, limiting use in regulated eco-designs.

GUS-SS8B-02-6491-FF Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC front-ends.
• Signal Conditioning: Stable resistance matching in instrumentation amplifiers.
• Industrial Control Systems: Reliable performance in PLCs and motor drivers.
• Telecom Infrastructure: Bias networks for RF modules or baseband processing.
• Medical Devices: Low-drift circuits where temperature stability is critical (non-implantable).

Conclusion of GUS-SS8B-02-6491-FF

The GUS-SS8B-02-6491-FF excels in applications requiring high precision, compactness, and thermal resilience. Its thin-film construction and tight tolerances outperform carbon or thick-film alternatives in drift-sensitive designs. While unsuitable for automotive or RoHS-mandated projects, it remains a top choice for industrial, medical, and telecom systems where reliability under thermal stress is paramount. Engineers benefit from its balanced power handling and space-saving SOIC footprint, making it a versatile solution for complex circuit topologies.