TT Electronics/IRC

GUS-SS8B-02-68R0-JF

GUS-SS8B-02-68R0-JF Description

The GUS-SS8B-02-68R0-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 68Ω resistance value and a 5% tolerance, delivering a total power rating of 0.8W (0.05W per resistor). The device operates within a wide temperature range of -70°C to +125°C, with a ±50ppm/°C temperature coefficient, ensuring stability under thermal stress. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating makes it suitable for moderate-voltage circuits.

GUS-SS8B-02-68R0-JF Features

• Thin-Film Technology: Offers superior accuracy, low noise, and stable performance compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• High Power Density: 0.8W total power dissipation in a small footprint, ideal for space-constrained designs.
• Robust Construction: Withstands 125°C maximum operating temperature, suitable for industrial environments.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Non-Automotive, Non-PPAP: Compliant with general industrial standards (EAR99 ECCN, HTS 8533.21.00.20).

GUS-SS8B-02-68R0-JF Applications

• Signal Conditioning: Precision resistor networks for ADC/DAC interfaces.
• Bus Termination: Effective impedance matching in high-speed digital circuits (e.g., memory buses).
• Voltage Division: Reliable performance in sensor biasing and reference voltage networks.
• Industrial Electronics: Suitable for control systems, test equipment, and instrumentation due to its thermal stability.
• Consumer Electronics: Compact size and efficiency make it ideal for portable devices.

Conclusion of GUS-SS8B-02-68R0-JF

The GUS-SS8B-02-68R0-JF excels in precision, power efficiency, and thermal resilience, making it a standout choice for high-density PCB designs. Its thin-film technology and SOIC gull-wing package provide a competitive edge in applications demanding tight tolerances and repeatability. While not RoHS-compliant, its industrial-grade robustness and broad operating range ensure reliability in demanding environments. Engineers will appreciate its balance of performance and compactness, particularly in signal integrity-critical designs.