TT Electronics/IRC

GUS-SS8B-02-7502-JD

GUS-SS8B-02-7502-JD Description

The GUS-SS8B-02-7502-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount configurations. This 16-pin SOIC device integrates 15 resistors with a 75K Ohm resistance value, offering a 5% tolerance and a ±50ppm/°C temperature coefficient for stable operation across a -70°C to +125°C range. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it ensures reliable performance in demanding circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB assembly, while its compact 9.91mm × 5.99mm × 1.45mm footprint suits space-constrained designs.

GUS-SS8B-02-7502-JD Features

• High-Density Integration: 15 resistors in a 16-pin SOIC package optimize board space.
• Precision Thin-Film Technology: Delivers low noise and excellent stability (±50ppm/°C TCR).
• Robust Power Handling: 0.8W total dissipation (derated up to 125°C) ensures reliability in high-temperature environments.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch comply with standard SMD processes.
• Wide Voltage Range: Supports up to 100V, making it suitable for industrial and instrumentation applications.
• Non-Automotive (PPAP No): Ideal for non-automotive precision electronics where RoHS compliance is not mandatory.

GUS-SS8B-02-7502-JD Applications

• Signal Conditioning Circuits: Precision voltage dividers and pull-up networks in sensor interfaces.
• Industrial Control Systems: Stable resistance for PLC I/O modules and ADC/DAC reference networks.
• Test & Measurement Equipment: Low-drift performance in multimeters and oscilloscope probes.
• Medical Electronics: Reliable operation in patient monitoring systems (non-critical applications).
• Telecom Infrastructure: Impedance matching in RF signal chains and baseband processing.

Conclusion of GUS-SS8B-02-7502-JD

The GUS-SS8B-02-7502-JD stands out for its precision, power efficiency, and compact design, making it a superior choice for high-density PCBs requiring stable resistive networks. Its thin-film technology and wide operating temperature range cater to industrial and instrumentation needs, while the SOIC package ensures compatibility with standard SMT workflows. Though not RoHS-compliant, it remains a cost-effective solution for non-regulated markets. Engineers will appreciate its balance of performance, durability, and ease of integration in complex electronic systems.