TT Electronics/IRC

GUS-SS8B-02-8252-GD

GUS-SS8B-02-8252-GD Description

The GUS-SS8B-02-8252-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 82.5KΩ resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. With a ±50ppm/°C temperature coefficient, it maintains stability across a wide operating range of 70°C to 125°C, making it suitable for environments with fluctuating thermal conditions. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating provide robust electrical performance, while the gull-wing termination ensures reliable surface-mount (SMD) compatibility.

GUS-SS8B-02-8252-GD Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±2% tolerance).
• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package.
• Thermal Stability: ±50ppm/°C TCR ensures minimal resistance drift.
• Robust Power Handling: 0.8W total (0.05W per resistor) with derating up to 125°C.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch for easy SMD placement.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications.

GUS-SS8B-02-8252-GD Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and feedback networks.
• Medical Electronics: Stable performance in diagnostic equipment.
• Test & Measurement Systems: High-accuracy instrumentation.
• Industrial Control Systems: Reliable operation in harsh environments.
• Communication Hardware: Signal integrity in RF and mixed-signal circuits.

Conclusion of GUS-SS8B-02-8252-GD

The GUS-SS8B-02-8252-GD stands out for its precision, thermal resilience, and compact design, making it a superior choice for applications requiring stable, high-density resistance networks. While not automotive-grade, its thin-film technology and tight tolerances cater to industrial, medical, and communication systems where accuracy and reliability are critical. Its SOIC package ensures compatibility with modern SMD assembly processes, streamlining production efficiency.