TT Electronics/IRC

GUS-SS8B-02-8451-FF

GUS-SS8B-02-8451-FF Description

The GUS-SS8B-02-8451-FF from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 8.45KΩ resistance value, offering 1% tolerance and a ±50ppm/°C temperature coefficient for stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for reliability in compact, high-density circuits. Its gull-wing termination ensures secure PCB mounting, while the rectangular SOIC case (9.91mm x 5.99mm x 1.45mm) adheres to tight dimensional tolerances (±0.1mm height, ±0.2mm depth).

GUS-SS8B-02-8451-FF Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Robust Construction: SOIC package with gull-wing leads resists mechanical stress and thermal cycling.
• Optimized Power Handling: 0.8W total dissipation (0.05W/resistor) at 125°C maximum operating temperature.
• Tight Tolerances: 1% resistance accuracy and ±50ppm/°C TCR ensure consistent performance in varying environments.
• Space-Efficient Design: 9.91mm x 5.99mm footprint ideal for high-density PCBs.
• Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation applications.

GUS-SS8B-02-8451-FF Applications

• Voltage Dividers & Signal Conditioning: Precision networks for ADC/DAC reference circuits.
• Medical Electronics: Stable resistance in diagnostic equipment where drift is critical.
• Industrial Control Systems: Reliable operation in PLCs, sensors, and power management modules.
• Telecom Infrastructure: High-frequency signal processing in base stations and routers.
• Test & Measurement Equipment: Low-noise performance for calibration and accuracy-critical systems.

Conclusion of GUS-SS8B-02-8451-FF

The GUS-SS8B-02-8451-FF excels in applications requiring precision, compactness, and thermal resilience. Its thin-film technology, tight tolerances, and robust SOIC package make it a superior choice over thicker-film or less stable alternatives. While not RoHS-compliant, it remains a go-to solution for industrial and telecom designs where performance outweighs regulatory constraints. Engineers will appreciate its balance of power handling, space savings, and repeatability in critical circuits.