TT Electronics/IRC

GUS-SS8B-02-95R3-FD

GUS-SS8B-02-95R3-FD Description

The GUS-SS8B-02-95R3-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 95.3 Ω resistance value, offering a tight 1% tolerance and a low ±50 ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. The gull-wing termination ensures secure PCB mounting, while the compact 9.91mm × 5.99mm × 1.45mm footprint optimizes space efficiency.

GUS-SS8B-02-95R3-FD Features

• Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy (±1%).
• Robust Construction: SOIC package with gull-wing leads for mechanical durability and ease of soldering.
• High Power Handling: 0.8W total power rating (0.05W per resistor) at 125°C maximum operating temperature.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive-grade circuits (though not PPAP/automotive-certified).
• Stable Thermal Performance: ±50 ppm/°C TCR ensures minimal resistance drift under thermal stress.
• Compact & Reliable: Tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth) for consistent PCB assembly.

GUS-SS8B-02-95R3-FD Applications

• Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Controls: Analog/digital interfaces in PLCs, sensors, and instrumentation.
• Communication Systems: Impedance matching and termination in high-frequency PCBs.
• Test & Measurement Equipment: Calibration circuits requiring long-term stability.
• Power Management: Current sensing and balancing in low-power DC/DC converters.

Conclusion of GUS-SS8B-02-95R3-FD

The GUS-SS8B-02-95R3-FD excels in applications demanding precision, thermal resilience, and space efficiency. Its thin-film technology, high power density, and robust SOIC package make it a superior choice over thicker-film or less stable alternatives. While not automotive-grade, its wide temperature range and low TCR cater to industrial and telecom needs where reliability is critical. Engineers will value its repeatable performance in tightly toleranced designs.