TT Electronics/IRC

GUS-SS8B-03-1052-J

GUS-SS8B-03-1052-J Description

The GUS-SS8B-03-1052-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. Packaged in a 16-pin SOIC with gull-wing termination, this 15-resistor array offers a 10.5KΩ resistance per element with a 5% tolerance and a ±25ppm/°C temperature coefficient. Its 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating ensure reliability in demanding circuits. The compact 9.91mm × 5.99mm × 1.45mm footprint, combined with surface-mount (SMD) compatibility, makes it ideal for space-constrained designs. Rated for -70°C to +125°C operation, it suits industrial and commercial environments where thermal stability is critical.

GUS-SS8B-03-1052-J Features

• Precision Thin Film Technology: Delivers low noise and stable performance over temperature.
• High-Density Integration: 15 resistors in a 16-pin SOIC, reducing board space versus discrete components.
• Robust Power Handling: 0.8W total dissipation with derated performance up to 125°C.
• Tight Tolerances: ±5% resistance and ±25ppm/°C TCR ensure consistent signal integrity.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch simplify PCB mounting.
• Wide Voltage Range: Supports up to 100V, suitable for analog and mixed-signal circuits.

GUS-SS8B-03-1052-J Applications

This resistor network excels in:

• Analog Signal Conditioning: Voltage dividers, DAC/ADC interfaces, and sensor calibration.
• Industrial Control Systems: PLCs, motor drives, and power management circuits requiring thermal resilience.
• Test & Measurement Equipment: Precision instrumentation where low TCR and minimal drift are vital.
• Consumer Electronics: Audio amplifiers and display drivers benefiting from compact, high-density resistance solutions.

Conclusion of GUS-SS8B-03-1052-J

The GUS-SS8B-03-1052-J combines precision, power efficiency, and compactness, making it a superior choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and SOIC packaging offer a balance of performance and manufacturability, ideal for modern surface-mount PCB designs. While not RoHS-compliant, its wide temperature range and low TCR ensure longevity in industrial and commercial applications where alternative networks may falter.