TT Electronics/IRC

GUS-SS8B-03-1132-DC

GUS-SS8B-03-1132-DC Description

The GUS-SS8B-03-1132-DC from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin SOIC (Small Outline Integrated Circuit) device integrates 15 resistors with a 11.3K Ohm resistance value, offering a tight tolerance of ±0.5% and a low temperature coefficient of ±25ppm/°C. With a 0.8W total power rating (0.05W per resistor) and a maximum operating temperature of 125°C, it ensures reliable performance in thermally challenging environments. The gull-wing termination and surface-mount design facilitate automated PCB assembly, while the 100V maximum voltage rating enhances versatility in circuit designs.

GUS-SS8B-03-1132-DC Features

• Precision Thin Film Technology: Delivers stable resistance values with minimal drift (±25ppm/°C) over a wide temperature range (70°C to 125°C).
• Compact & Robust: SOIC package (9.91mm x 5.99mm x 1.45mm) with tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Handling: 0.8W total dissipation (0.05W per resistor) for energy-efficient designs.
• Automation-Friendly: Gull-wing SMD terminals with 1.27mm pitch ensure compatibility with pick-and-place systems.
• BUS Circuit Designator: Optimized for bus line termination, voltage division, and pull-up/down applications.
• Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation use (not automotive-qualified).

GUS-SS8B-03-1132-DC Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Termination Networks: Bus line termination for high-speed digital interfaces (e.g., SPI, I²C).
• Medical & Test Equipment: Stable reference resistors in diagnostic devices.
• Industrial Controls: Feedback networks in power supplies or motor drives.
• Telecom Infrastructure: Impedance matching in RF modules.

Conclusion of GUS-SS8B-03-1132-DC

The GUS-SS8B-03-1132-DC combines high accuracy, thermal stability, and compact packaging, making it ideal for precision analog and mixed-signal designs. Its thin-film construction and low TCR outperform carbon or thick-film alternatives, while the SOIC-16 footprint balances space savings with power handling. Though not RoHS-compliant, it remains a top choice for industrial and telecom applications where reliability and precision are critical. Packaged in tubes for safe shipping, this network simplifies BOM consolidation without compromising performance.