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GUS-SS8B-03-1602-FD
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GUS-SS8B-03-1602-FD Description
GUS-SS8B-03-1602-FD Description
The GUS-SS8B-03-1602-FD from TT Electronics/IRC is a high-performance 16KΩ thin-film resistor network designed for precision applications. Packaged in a 16-pin SOIC with gull-wing termination, this 15-resistor array offers a 1% tolerance, ±25ppm/°C temperature coefficient, and a 0.8W total power rating (0.05W per resistor). Its compact 9.91mm x 5.99mm x 1.45mm footprint and surface-mount design make it ideal for space-constrained PCBs. With a 100V maximum voltage rating and an operating temperature range of 70°C to 125°C, this non-automotive, non-PPAP compliant component is engineered for reliability in industrial and commercial electronics.
GUS-SS8B-03-1602-FD Features
- Precision Thin Film Technology: Delivers stable performance with ±25ppm/°C TCR and 1% tolerance for critical circuits.
- High-Density Integration: 15 resistors in a 16-pin SOIC save board space versus discrete components.
- Robust Power Handling: 0.8W total power dissipation (0.05W/resistor) at 125°C maximum temperature.
- Stable Termination: Gull-wing leads ensure reliable solder joints in surface-mount applications.
- Wide Voltage Range: Supports up to 100V, suitable for analog and digital signal conditioning.
- Strict Dimensional Tolerances: ±0.1mm height/length and ±0.2mm depth tolerances ensure consistent placement.
GUS-SS8B-03-1602-FD Applications
- Signal Conditioning: Ideal for voltage dividers, pull-up/pull-down networks, and impedance matching in communication systems.
- Industrial Controls: Used in PLC I/O modules, sensor interfaces, and test equipment due to its stability under thermal stress.
- Medical Electronics: Suitable for low-noise analog circuits in diagnostic devices where precision is critical.
- Consumer Electronics: Deployed in audio equipment, display drivers, and power management circuits.
Conclusion of GUS-SS8B-03-1602-FD
The GUS-SS8B-03-1602-FD stands out for its precision, compactness, and thermal resilience, making it a superior choice over thicker-film or discrete alternatives. Its thin-film construction ensures long-term stability, while the SOIC package simplifies assembly. Engineers will value its balance of performance, density, and cost-effectiveness in high-reliability applications. For designs demanding tight tolerances and minimal drift, this resistor network delivers consistent results.



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