TT Electronics/IRC

GUS-SS8B-03-1652-FC

GUS-SS8B-03-1652-FC Description

The GUS-SS8B-03-1652-FC is a high-precision thin-film resistor network from TT Electronics/IRC, designed for demanding surface-mount (SMD) applications. This 16-pin SOIC package integrates 15 resistors with a 16.5KΩ resistance value, offering 1% tolerance and a low ±25ppm/°C temperature coefficient for stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it ensures reliability in precision circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while its compact 9.91mm × 5.99mm × 1.45mm footprint suits space-constrained designs.

GUS-SS8B-03-1652-FC Features

• High Precision: 1% tolerance and ±25ppm/°C TCR ensure minimal drift in critical applications.
• Robust Construction: Thin-film technology delivers superior stability and low noise compared to thick-film alternatives.
• Space-Efficient: SOIC-16 package with 0.8W total power dissipation optimizes board real estate.
• Wide Operating Range: Rated for -55°C to +125°C, derated to 70°C to 125°C at full power.
• Automation-Friendly: Gull-wing leads and standard SOIC footprint simplify pick-and-place assembly.
• Non-Automotive: Suitable for industrial, medical, and telecom applications where PPAP compliance is not required.

GUS-SS8B-03-1652-FC Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning in test equipment.
• Signal Processing: DAC/ADC reference networks, gain setting, and impedance matching.
• Industrial Electronics: PLCs, power supplies, and control systems requiring stable resistance under thermal stress.
• Medical Devices: Patient monitoring and diagnostic equipment where accuracy is critical.
• Telecom Infrastructure: Base stations and RF modules benefiting from low TCR and compact design.

Conclusion of GUS-SS8B-03-1652-FC

The GUS-SS8B-03-1652-FC excels in applications demanding high precision, thermal stability, and compactness. Its thin-film technology, tight tolerances, and robust SOIC package make it ideal for industrial, medical, and telecom systems. While not PPAP-compliant, its performance and reliability position it as a superior choice for non-automotive precision networks. Engineers will appreciate its balance of power handling, space efficiency, and ease of integration in SMD designs.