TT Electronics/IRC

GUS-SS8B-03-1692-C

GUS-SS8B-03-1692-C Description

The GUS-SS8B-03-1692-C from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors, each with a 16.9KΩ resistance value and an ultra-tight 0.25% tolerance, ensuring exceptional accuracy in signal conditioning and voltage division circuits. With a ±25ppm/°C temperature coefficient, it delivers stable performance across a wide operating range of 70°C to 125°C, making it suitable for environments with thermal fluctuations. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating provide robust reliability in compact designs.

GUS-SS8B-03-1692-C Features

• Precision Thin Film Technology: Offers low noise and high stability for critical analog circuits.
• Compact SOIC-16 Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with gull-wing terminations for secure SMD mounting.
• High Power Density: 0.8W total dissipation in a minimal footprint, ideal for space-constrained PCBs.
• Wide Temperature Range: Operates reliably up to 125°C, outperforming standard commercial-grade networks.
• BUS Circuit Designator: Optimized for bus termination and pull-up/pull-down applications.
• Non-Automotive (PPAP No): Tailored for industrial, telecom, and instrumentation use.

GUS-SS8B-03-1692-C Applications

This resistor network excels in:

• Precision Analog Circuits: DAC/ADC reference networks, sensor signal conditioning.
• Bus Termination: DDR memory interfaces, FPGA/ASIC systems requiring impedance matching.
• Medical & Test Equipment: High-accuracy measurement devices where drift is critical.
• Industrial Controls: PLCs, motor drives, and power management modules.

Conclusion of GUS-SS8B-03-1692-C

The GUS-SS8B-03-1692-C combines precision, power efficiency, and thermal resilience in a compact SOIC package. Its thin-film construction and 0.25% tolerance make it a superior choice over thick-film alternatives for high-reliability applications. While not RoHS-compliant, it remains a go-to solution for industrial and telecom designs demanding long-term stability under thermal stress. Engineers will appreciate its balance of performance and miniaturization, reducing BOM complexity without sacrificing accuracy.