TT Electronics/IRC

GUS-SS8B-03-1782-J

GUS-SS8B-03-1782-J Description

The GUS-SS8B-03-1782-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC device integrates 15 resistors, each with a 17.8KΩ resistance (5% tolerance) and a ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is engineered for reliability in demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the compact dimensions (9.91mm x 5.99mm x 1.45mm) make it ideal for space-constrained layouts.

GUS-SS8B-03-1782-J Features

• Thin-film technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
• High power density: 0.8W total dissipation in a miniature SOIC package.
• Stable thermal performance: ±25ppm/°C TCR ensures minimal resistance drift.
• Robust construction: SOIC-16 gull-wing termination resists mechanical stress.
• Automation-friendly: Supplied in tubes for efficient pick-and-place assembly.
• Wide operating range: Rated for -55°C to +125°C, suitable for industrial environments.

GUS-SS8B-03-1782-J Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and sensor signal conditioning in test equipment.
• Bus termination for high-speed data lines (e.g., CAN, SPI).
• Feedback networks in op-amp and ADC/DAC circuits.
• Power supply balancing in multi-rail systems.
• Medical devices and aerospace electronics where stability is critical.

Conclusion of GUS-SS8B-03-1782-J

The GUS-SS8B-03-1782-J combines high precision, thermal resilience, and compact packaging, making it a standout choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and low TCR outperform generic resistor arrays, while the SOIC-16 format ensures compatibility with automated assembly processes. Ideal for industrial, automotive (non-PPAP), and instrumentation designs, this network delivers consistent performance where tolerance and temperature stability are paramount.