TT Electronics/IRC

GUS-SS8B-03-1911-J

GUS-SS8B-03-1911-J Description

The GUS-SS8B-03-1911-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC device integrates 15 resistors with a 1.91KΩ resistance value, offering a 5% tolerance and a ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is engineered for reliability in demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its compact dimensions (9.91mm x 5.99mm x 1.45mm) make it ideal for space-constrained layouts.

GUS-SS8B-03-1911-J Features

• Thin-Film Technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
• High Power Density: 0.8W total dissipation in a miniature SOIC package, optimizing thermal performance.
• Stable TCR: ±25ppm/°C ensures minimal resistance drift under temperature fluctuations.
• Robust Construction: Rectangular SOIC case with ±0.1mm height/length tolerances for consistent mounting.
• Automated Assembly-Friendly: Gull-wing leads and 1.27mm pitch enable high-speed SMT processes.
• Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance isn’t required.

GUS-SS8B-03-1911-J Applications

This resistor network excels in:

• Voltage Division/Current Limiting: Precision networks in ADC/DAC circuits and sensor interfaces.
• Signal Conditioning: Stable performance in op-amp feedback loops and filter networks.
• Industrial Controls: Durable operation in PLC modules and power management systems.
• Telecom Infrastructure: Reliable termination in high-frequency communication PCBs.
• Test & Measurement Equipment: Low-drift characteristics critical for calibration circuits.

Conclusion of GUS-SS8B-03-1911-J

The GUS-SS8B-03-1911-J stands out for its thin-film precision, thermal resilience, and compact form factor, making it a superior choice over generic thick-film arrays. Its balanced combination of power handling, tolerance, and TCR caters to advanced electronic designs requiring repeatable performance. While not RoHS-compliant, it remains a cost-effective solution for non-consumer applications where environmental regulations are secondary to technical specifications. Engineers will appreciate its drop-in compatibility with standard SOIC footprints and its proven reliability in harsh operational environments.