TT Electronics/IRC

GUS-SS8B-03-2100-FD

GUS-SS8B-03-2100-FD Description

The GUS-SS8B-03-2100-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. Encased in a 16-pin SOIC package with gull-wing terminations, this device integrates 15 resistors with a uniform 210Ω resistance, 1% tolerance, and a low ±25ppm/°C temperature coefficient. It delivers a total power rating of 0.8W (0.05W per resistor) and operates reliably across a wide temperature range of -70°C to +125°C. Its compact dimensions (9.91mm x 5.99mm x 1.45mm) and ±0.1mm height tolerance ensure compatibility with high-density PCB designs.

GUS-SS8B-03-2100-FD Features

• Precision Thin Film Technology: Ensures stable performance with minimal drift over temperature and time.
• High Power Density: 0.8W total dissipation in a compact SOIC package, ideal for space-constrained applications.
• Robust Construction: 100V maximum voltage rating and 125°C maximum operating temperature suit industrial environments.
• Strict Tolerances: ±0.1mm length/height tolerances and ±0.2mm depth tolerance for consistent manufacturability.
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down networks in digital systems.
• Non-Automotive (PPAP No): Tailored for industrial, telecom, and instrumentation use.

GUS-SS8B-03-2100-FD Applications

• Digital Signal Processing: Bus termination for high-speed data lines (e.g., DDR memory, FPGA interfaces).
• Precision Voltage Dividers: Used in ADC/DAC reference circuits and sensor signal conditioning.
• Embedded Systems: Pull-up/down networks in microcontrollers and communication modules (I²C, SPI).
• Test & Measurement Equipment: Stable resistance networks for calibration and feedback loops.
• Power Management: Current-limiting and load-sharing in low-power DC/DC converters.

Conclusion of GUS-SS8B-03-2100-FD

The GUS-SS8B-03-2100-FD excels in applications requiring high precision, thermal stability, and compactness. Its thin-film technology, tight tolerances, and robust SOIC package make it superior to thicker-film or discrete alternatives in critical signal-path designs. While not RoHS-compliant, it remains a preferred choice for industrial and telecom systems where reliability outweighs regulatory constraints. Ideal for engineers prioritizing performance-per-volume in advanced PCB layouts.