TT Electronics/IRC

GUS-SS8B-03-2210-FD

GUS-SS8B-03-2210-FD Description

The GUS-SS8B-03-2210-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC device integrates 15 resistors with a 221Ω resistance value, offering a tight 1% tolerance and a low ±25ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. The gull-wing termination ensures secure PCB mounting, while the compact 9.91mm × 5.99mm × 1.45mm footprint optimizes board space. Packaged in a tube, this non-automotive component is ideal for precision analog and digital circuits.

GUS-SS8B-03-2210-FD Features

• High Accuracy: 1% tolerance and ±25ppm/°C TCR ensure stable performance in precision applications.
• Robust Construction: Thin-film technology provides superior reliability and low noise.
• Space-Efficient: SOIC-16 package with a 1.27mm terminal pitch simplifies high-density PCB layouts.
• Wide Operating Range: Derated power up to 125°C and 100V maximum voltage rating for versatile use.
• Non-Compliant with EU RoHS: Suitable for applications exempt from RoHS restrictions.
• BUS Circuit Designator: Optimized for bus termination and voltage division in communication systems.

GUS-SS8B-03-2210-FD Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and pull-up/down networks in ADCs/DACs.
• Bus Termination: Impedance matching for high-speed data lines (e.g., CAN, LVDS).
• Industrial Electronics: Control systems, sensor interfaces, and power management where temperature stability is critical.
• Test & Measurement Equipment: Calibration circuits and reference networks requiring low drift.
• Aerospace & Defense: Non-RoHS compliant applications with stringent reliability requirements.

Conclusion of GUS-SS8B-03-2210-FD

The GUS-SS8B-03-2210-FD stands out for its precision, compactness, and thermal resilience, making it a top choice for engineers designing high-reliability analog systems. Its thin-film technology and SOIC packaging strike a balance between performance and manufacturability, while the BUS configuration simplifies circuit design. Though not RoHS-compliant, it remains indispensable in industrial, aerospace, and specialized commercial applications where stability under extreme conditions is paramount.