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GUS-SS8B-03-2320-J
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GUS-SS8B-03-2320-J Description
GUS-SS8B-03-2320-J Description
The GUS-SS8B-03-2320-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. Encased in a 16-pin SOIC package with gull-wing terminations, it features 15 resistors with a 232Ω resistance value, 5% tolerance, and a ±25ppm/°C temperature coefficient. This surface-mount (SMD) component offers a 0.8W total power rating (0.05W per resistor) and operates within a wide temperature range of 70°C to 125°C, making it suitable for demanding environments. Its compact dimensions (9.91mm x 5.99mm x 1.45mm) and ±0.1mm height/length tolerances ensure reliable integration into densely populated PCBs.
GUS-SS8B-03-2320-J Features
- High Precision: Thin-film technology delivers stable performance with low TCR (±25ppm/°C) and tight tolerance (±5%).
- Robust Construction: SOIC package with gull-wing leads ensures mechanical durability and ease of soldering.
- Optimized Power Handling: 0.8W total dissipation (0.05W per resistor) at 125°C maximum operating temperature.
- Space-Efficient: Ultra-thin 1.45mm profile and 1.27mm terminal pitch ideal for miniaturized designs.
- Broad Compatibility: 100V maximum voltage rating supports diverse circuit requirements.
- Non-Automotive: Compliant with industrial standards (EAR99 ECCN, HTS 8533.21.00.20), though not PPAP or RoHS certified.
GUS-SS8B-03-2320-J Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers and pull-up/down networks in data acquisition systems.
- Analog Circuits: Feedback networks for op-amps, ADCs, and DACs requiring low drift.
- Industrial Electronics: PLC modules, sensor interfaces, and power management PCBs.
- Test & Measurement Equipment: Calibration circuits demanding long-term stability.
- Aerospace & Defense: Non-critical subsystems where thin-film reliability is prioritized over RoHS compliance.
Conclusion of GUS-SS8B-03-2320-J
The GUS-SS8B-03-2320-J stands out for its precision, power efficiency, and compact form factor, making it a versatile choice for industrial and instrumentation designs. While not suited for automotive or RoHS-mandated applications, its thin-film technology and robust package ensure consistent performance in high-temperature, precision-critical environments. Engineers will appreciate its balance of density, reliability, and ease of integration in space-constrained layouts.



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