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GUS-SS8B-03-2702-GF
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GUS-SS8B-03-2702-GF Description
GUS-SS8B-03-2702-GF Description
The GUS-SS8B-03-2702-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package features 15 resistors with a 27K Ohm resistance value, 2% tolerance, and a ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is ideal for demanding circuits requiring reliability and accuracy. Its gull-wing termination and surface-mount design facilitate easy integration into compact PCB layouts.
GUS-SS8B-03-2702-GF Features
- Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
- Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
- High Power Density: 0.8W total dissipation in a small footprint, outperforming similar networks in thermal management.
- Wide Operating Range: Functions reliably from -55°C to +125°C (derated power up to 125°C).
- Automotive-Grade Alternatives Available: While this model is not PPAP or automotive-qualified, TT Electronics offers variants for harsh environments.
GUS-SS8B-03-2702-GF Applications
- Signal Conditioning: Ideal for ADC/DAC circuits, voltage dividers, and sensor interfaces due to low TCR (±25ppm/°C).
- Industrial Controls: Suited for PLC modules, motor drivers, and power supplies where space and precision are critical.
- Communications Equipment: Used in filter networks and impedance matching for RF/analog signal integrity.
- Test & Measurement: Ensures accuracy in calibration tools and data acquisition systems.
Conclusion of GUS-SS8B-03-2702-GF
The GUS-SS8B-03-2702-GF combines precision, compactness, and robust power handling, making it a standout choice for engineers designing high-reliability electronics. Its thin-film construction and tight tolerances address challenges in miniaturized and thermally constrained applications, while the SOIC gull-wing package simplifies assembly. For projects demanding stable resistance networks with minimal drift, this model offers a compelling balance of performance and cost-effectiveness.



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