TT Electronics/IRC

GUS-SS8B-03-2740-DD

GUS-SS8B-03-2740-DD Description

The GUS-SS8B-03-2740-DD is a high-precision thin-film resistor network from TT Electronics/IRC, designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 274Ω resistance value, offering a tight tolerance of ±0.5% and a low temperature coefficient of ±25ppm/°C. With a 0.8W total power rating (0.05W per resistor) and an operating temperature range of 70°C to 125°C, it ensures stable performance in precision circuits. The gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB mounting, while its compact dimensions (9.91mm × 5.99mm × 1.45mm) suit space-constrained designs.

GUS-SS8B-03-2740-DD Features

• Precision Thin Film Technology: Delivers high accuracy (±0.5%) and low TCR (±25ppm/°C) for stable performance.
• Robust Construction: SOIC package with gull-wing leads ensures mechanical durability and ease of soldering.
• High Power Handling: 0.8W total power dissipation (0.05W per resistor) at up to 125°C.
• Wide Voltage Rating: Supports up to 100V, making it suitable for analog and mixed-signal circuits.
• Compact & Lightweight: Ideal for high-density PCB layouts with a seated height of 1.63mm.
• Non-Automotive/Non-PPAP: Optimized for industrial, telecom, and instrumentation applications.

GUS-SS8B-03-2740-DD Applications

This resistor network excels in:

• Precision Voltage Dividers: Critical in ADC/DAC reference circuits due to low tolerance and TCR.
• Signal Conditioning: Used in sensor interfaces and feedback networks where stability is paramount.
• Medical & Test Equipment: Reliable performance in high-accuracy measurement systems.
• Telecom Infrastructure: Suitable for RF and baseband signal processing modules.
• Industrial Control Systems: Robust enough for harsh environments with derated power handling.

Conclusion of GUS-SS8B-03-2740-DD

The GUS-SS8B-03-2740-DD stands out for its precision, power efficiency, and compact form factor, making it a superior choice over thicker-film or less stable alternatives. Its thin-film technology and tight electrical specs cater to high-reliability applications, while the SOIC-16 package ensures compatibility with automated assembly processes. Ideal for engineers prioritizing accuracy and thermal performance in compact designs.