TT Electronics/IRC

GUS-SS8B-03-3481-FF

GUS-SS8B-03-3481-FF Description

The GUS-SS8B-03-3481-FF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors with a 3.48K Ohm resistance value, offering 1% tolerance and a low ±25ppm/°C temperature coefficient for stable operation across a -70°C to +125°C range. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it ensures reliability in demanding circuits. The gull-wing termination and surface-mount design facilitate automated assembly, while the tube packaging protects components during handling.

GUS-SS8B-03-3481-FF Features

• Precision Thin Film Technology: Delivers ±25ppm/°C thermal stability, ideal for sensitive analog/digital circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• High-Density Integration: Combines 15 resistors in a 16-pin BUS-configuration, reducing PCB footprint.
• Robust Performance: Rated for 125°C max operating temperature and 70°C derated power range.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch ensure compatibility with SMD processes.
• Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation applications.

GUS-SS8B-03-3481-FF Applications

• Voltage Division & Pull-Up Networks: Precision resistor arrays for ADC/DAC circuits.
• Signal Conditioning: Stable performance in sensor interfaces and feedback loops.
• Industrial Control Systems: Reliable operation in PLCs and power management modules.
• Telecom Infrastructure: Low-noise resistance networks for RF and baseband PCBs.
• Test & Measurement Equipment: High-accuracy dividers in oscilloscopes and multimeters.

Conclusion of GUS-SS8B-03-3481-FF

The GUS-SS8B-03-3481-FF excels in space-constrained, precision-critical designs, offering superior thermal stability and integration density. Its thin-film construction and tight tolerances make it a preferred choice over thicker-film or less stable alternatives. While not automotive-grade, it is ideal for industrial, telecom, and high-reliability electronics where consistent performance under thermal stress is paramount. The combination of low TCR, high power handling, and compact form factor positions this network as a versatile solution for advanced circuit design.