TT Electronics/IRC

GUS-SS8B-03-3570-FC

GUS-SS8B-03-3570-FC Description

The GUS-SS8B-03-3570-FC from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC (Small Outline Integrated Circuit) package features 15 resistors with a 357 Ohm resistance value and a tight 1% tolerance, ensuring reliable signal conditioning and voltage division. With a 0.8W total power rating (0.05W per resistor) and a ±25ppm/°C temperature coefficient, it delivers stable performance across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design make it ideal for automated assembly processes.

GUS-SS8B-03-3570-FC Features

• Precision Thin Film Technology: Offers low noise and high stability for sensitive circuits.
• Compact SOIC Package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Voltage Rating: Supports up to 100V, suitable for industrial and telecom applications.
• Robust Thermal Performance: Operates at 125°C max with derated power up to 125°C.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch ensure compatibility with pick-and-place systems.
• Non-Automotive, Non-PPAP: Ideal for commercial and industrial use where PPAP compliance is not required.

GUS-SS8B-03-3570-FC Applications

This resistor network excels in:

• Signal Conditioning: Precision dividers and feedback networks in op-amp circuits.
• Telecommunications: Impedance matching and termination in high-frequency PCBs.
• Industrial Controls: Stable resistance in harsh environments (e.g., motor drives, power supplies).
• Test & Measurement Equipment: Calibration and reference circuits demanding low TCR (±25ppm/°C).
• Consumer Electronics: Space-constrained designs requiring reliable SMD components.

Conclusion of GUS-SS8B-03-3570-FC

The GUS-SS8B-03-3570-FC combines precision, compactness, and thermal resilience, making it a superior choice for engineers prioritizing accuracy and reliability in dense PCB layouts. Its thin-film construction and 1% tolerance outperform carbon-based alternatives, while the SOIC package ensures compatibility with modern manufacturing workflows. Though not RoHS-compliant, it remains a cost-effective solution for non-regulated industrial and commercial applications.