TT Electronics/IRC

GUS-SS8B-03-3741-JC

GUS-SS8B-03-3741-JC Description

The GUS-SS8B-03-3741-JC from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package features 15 resistors with a 3.74K Ohm resistance value, 5% tolerance, and a ±25ppm/°C temperature coefficient, ensuring stable performance across a 70 to 125°C derated power range. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount (SMD) component is ideal for compact, high-density PCB designs. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable soldering, while the tube packaging ensures safe handling and storage.

GUS-SS8B-03-3741-JC Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Wide Temperature Range: Operates reliably from -55°C to 125°C, with derated power up to 125°C.
• BUS Circuit Designator: Optimized for bus line termination, voltage division, and pull-up/down applications.
• Non-Automotive, Non-PPAP: Suitable for industrial, telecom, and consumer electronics.
• Non-RoHS Compliant: For applications requiring legacy material compliance.

GUS-SS8B-03-3741-JC Applications

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Bus Termination: DDR memory, FPGA, and microcontroller interfaces.
• Industrial Controls: PLCs, sensor arrays, and power management systems.
• Telecom Infrastructure: Line drivers, repeaters, and RF modules.
• Test & Measurement Equipment: Calibration and reference circuits.

Conclusion of GUS-SS8B-03-3741-JC

The GUS-SS8B-03-3741-JC excels in high-density, precision applications where thermal stability and compact form factor are critical. Its thin-film technology and rigorous tolerances make it superior to thick-film alternatives in noise-sensitive designs. While not suited for automotive use, it is a cost-effective solution for industrial, telecom, and embedded systems. Engineers will appreciate its reliability in harsh environments and ease of integration into surface-mount assemblies.