


TT Electronics/IRC
GUS-SS8B-03-4530-JG
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GUS-SS8B-03-4530-JG Description
GUS-SS8B-03-4530-JG Description
The GUS-SS8B-03-4530-JG is a high-performance thin-film resistor network from TT Electronics/IRC, designed for precision applications requiring stable resistance and tight tolerances. This 16-pin SOIC package integrates 15 resistors with a 453 Ω resistance value, offering a 5% tolerance and a ±25 ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. The gull-wing termination and surface-mount design ensure easy PCB integration, while its compact dimensions (9.91mm x 5.99mm x 1.45mm) make it ideal for space-constrained designs.
GUS-SS8B-03-4530-JG Features
- Thin-Film Technology: Delivers superior stability, low noise, and precise resistance matching.
- High Power Rating: 0.8W total power (0.05W per resistor) with derating up to 125°C.
- Robust Construction: SOIC package with ±0.1mm height/length tolerance for consistent manufacturing.
- Wide Voltage Range: Supports up to 100V maximum voltage, suitable for diverse circuit conditions.
- Automotive-Grade Alternatives: While not automotive-qualified, its thin-film performance makes it a candidate for industrial and telecom applications.
- Non-RoHS Compliance: Note for applications where RoHS is not mandatory.
GUS-SS8B-03-4530-JG Applications
- Precision Analog Circuits: Voltage dividers, sensor interfaces, and feedback networks.
- Telecommunications: Signal conditioning and impedance matching in RF modules.
- Industrial Control Systems: PLCs, motor drives, and power supplies requiring stable resistance.
- Test & Measurement Equipment: Calibration circuits and reference networks.
- Consumer Electronics: Audio amplifiers and display drivers where space efficiency is critical.
Conclusion of GUS-SS8B-03-4530-JG
The GUS-SS8B-03-4530-JG excels in precision, power handling, and thermal stability, making it a standout choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and compact SOIC package offer a balance of performance and space savings, ideal for industrial, telecom, and high-end consumer applications. While not PPAP or automotive-qualified, its technical specifications position it as a cost-effective alternative for non-automotive precision designs.



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