TT Electronics/IRC

GUS-SS8B-03-4641-FD

GUS-SS8B-03-4641-FD Description

The GUS-SS8B-03-4641-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC device integrates 15 resistors with a 4.64KΩ resistance value, offering 1% tolerance and a low ±25ppm/°C temperature coefficient for stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it ensures reliability in compact, high-density circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB assembly, while its 9.91mm × 5.99mm × 1.45mm footprint balances space efficiency with thermal dissipation.

GUS-SS8B-03-4641-FD Features

• Precision Thin Film Technology: Delivers superior accuracy (±1%) and low TCR (±25ppm/°C) for signal conditioning and voltage division.
• Robust Construction: SOIC package with rectangular shape and ±0.1mm height tolerance ensures mechanical stability in automated assembly.
• High Power Handling: 0.8W total dissipation (1/20W per resistor) supports sustained operation at elevated temperatures.
• Automation-Friendly: Gull-wing leads and standard 1.27mm pitch simplify pick-and-place processes.
• Non-Automotive/Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance is not required.
• Non-RoHS: Suitable for legacy designs or specific regulatory exemptions.

GUS-SS8B-03-4641-FD Applications

• Analog Signal Processing: Precision dividers and feedback networks in op-amp circuits.
• Medical Equipment: Stable resistance in diagnostic devices where thermal drift must be minimized.
• Test & Measurement Instruments: High-accuracy calibration and reference circuits.
• Industrial Control Systems: Durable performance in PLCs and sensor interfaces.
• Telecom Infrastructure: Reliable termination and impedance matching in communication hardware.

Conclusion of GUS-SS8B-03-4641-FD

The GUS-SS8B-03-4641-FD excels in applications demanding tight tolerance, low thermal drift, and compact form factors. Its thin-film technology and SOIC packaging make it a versatile choice for engineers prioritizing precision and repeatability in harsh environments. While not suited for automotive use, it is a cost-effective solution for industrial, medical, and telecom systems requiring stable resistive networks. The tube packaging further streamlines inventory management for high-volume production.