TT Electronics/IRC

GUS-SS8B-03-5102-JF

GUS-SS8B-03-5102-JF Description

The GUS-SS8B-03-5102-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 51K Ohm resistance and a 5% tolerance, delivering stable performance across a wide temperature range (70°C to 125°C). With a ±25ppm/°C temperature coefficient, it ensures minimal resistance drift under thermal stress. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-03-5102-JF Features

• Precision Thin Film Technology: Offers superior stability and low noise compared to thick-film alternatives.
• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package, ideal for space-constrained designs.
• Robust Thermal Performance: Operates reliably up to 125°C with derated power capabilities.
• Tight Tolerances: ±0.1mm height/length and ±0.2mm depth tolerances ensure consistent mounting.
• Automotive-Grade Alternatives: While not automotive-qualified (PPAP: No), its performance suits industrial and telecom applications.
• Non-RoHS Compliant: Suitable for legacy or exempted applications requiring leaded components.

GUS-SS8B-03-5102-JF Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Control Systems: PLCs and sensor interfaces requiring stable resistance over temperature.
• Telecommunications: RF and baseband circuitry where low TCR (±25ppm/°C) minimizes drift.
• Test & Measurement Equipment: Calibration and reference circuits demanding tight tolerances.
• Power Management: Load sharing and current sensing in multi-channel power supplies.

Conclusion of GUS-SS8B-03-5102-JF

The GUS-SS8B-03-5102-JF combines high precision, thermal resilience, and compact integration, making it a standout choice for engineers prioritizing reliability in harsh environments. Its thin-film construction and tight mechanical tolerances cater to advanced electronics, while the SOIC gull-wing package simplifies assembly. Though not RoHS-compliant, it remains a robust solution for industrial, telecom, and instrumentation designs where performance outweighs regulatory constraints. For applications demanding stable, low-drift resistance networks, this model delivers exceptional value.