TT Electronics/IRC

GUS-SS8B-03-5230-FC

GUS-SS8B-03-5230-FC Description

The GUS-SS8B-03-5230-FC from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 523Ω resistance value, offering a tight 1% tolerance and a low ±25ppm/°C temperature coefficient. With a 0.8W total power rating (0.05W per resistor) and a maximum operating temperature of 125°C, it ensures reliable performance in thermally challenging environments. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while its compact dimensions (9.91mm x 5.99mm x 1.45mm) make it ideal for space-constrained designs.

GUS-SS8B-03-5230-FC Features

• Precision Thin Film Technology: Delivers stable resistance values with minimal drift over temperature.
• High Power Handling: 0.8W total power rating (derated up to 125°C) for robust performance.
• Low TCR: ±25ppm/°C ensures consistent operation across a wide -70°C to +125°C range.
• Automated Assembly Friendly: Gull-wing leads and SOIC package optimize pick-and-place efficiency.
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.
• 100V Maximum Voltage Rating: Supports moderate voltage applications.

GUS-SS8B-03-5230-FC Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage Dividers & Signal Conditioning: Ideal for sensor interfaces and ADC/DAC circuits.
• Medical & Test Equipment: Low TCR and high accuracy suit critical measurement systems.
• Industrial Control Systems: Reliable performance in harsh environments with temperature fluctuations.
• Communication Hardware: Stable impedance matching for RF and baseband circuits.
• Power Management Modules: Efficient current limiting and bias networks.

Conclusion of GUS-SS8B-03-5230-FC

The GUS-SS8B-03-5230-FC combines high precision, thermal stability, and compact form factor, making it a superior choice for engineers prioritizing reliability in space-sensitive designs. Its thin-film construction and low TCR outperform carbon or thick-film alternatives, while the SOIC package ensures compatibility with standard SMD processes. Though not RoHS-compliant, it remains a cost-effective solution for industrial and instrumentation applications where precision is paramount.