TT Electronics/IRC

GUS-SS8B-03-5231-FD

GUS-SS8B-03-5231-FD Description

The GUS-SS8B-03-5231-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 5.23K Ohm resistance value, offering 1% tolerance and a low ±25ppm/°C temperature coefficient for stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it ensures reliability in precision circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while its compact 9.91mm × 5.99mm × 1.45mm dimensions suit space-constrained designs.

GUS-SS8B-03-5231-FD Features

• High Precision: Thin-film technology delivers 1% tolerance and ±25ppm/°C TCR for minimal drift.
• Robust Construction: SOIC package with gull-wing leads ensures mechanical durability and solderability.
• Wide Operating Range: Derated power operation up to 125°C for harsh environments.
• Optimized Power Handling: 0.8W total dissipation (0.05W per resistor) balances performance and thermal management.
• Space-Efficient: Compact rectangular footprint with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its stability suits industrial and telecom applications.

GUS-SS8B-03-5231-FD Applications

• Precision Analog Circuits: Voltage dividers, feedback networks in op-amps, and sensor interfaces.
• Signal Conditioning: ADC/DAC reference networks, gain-setting resistors in instrumentation.
• Industrial Controls: PLCs, power supplies, and measurement equipment requiring low TCR.
• Telecom Infrastructure: RF modules and baseband processing where consistency is critical.
• Medical Devices: Diagnostic equipment demanding stable resistance over temperature fluctuations.

Conclusion of GUS-SS8B-03-5231-FD

The GUS-SS8B-03-5231-FD excels in applications requiring high accuracy, thermal stability, and compactness. Its thin-film technology, tight tolerances, and robust SOIC package make it a superior choice over thicker-film or less stable alternatives. While not suited for automotive use, it is ideal for industrial, medical, and telecom systems where precision and reliability are paramount. The tube packaging ensures protection during handling and assembly, further enhancing its appeal for high-volume manufacturing.