TT Electronics/IRC

GUS-SS8B-03-6202-JF

GUS-SS8B-03-6202-JF Description

The GUS-SS8B-03-6202-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin SOIC package integrates 15 resistors, each with a 62K Ohm resistance value and a tight ±25ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of 70°C to 125°C. With a 5% tolerance and a maximum voltage rating of 100V, this network is engineered for reliability in surface-mount (SMD) configurations. Its gull-wing termination and 0.8W total power rating (0.05W per resistor) make it suitable for compact, high-density PCB designs.

GUS-SS8B-03-6202-JF Features

• Precision Thin Film Technology: Delivers low noise and high stability, ideal for analog and signal-processing circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with ±0.1mm length/height tolerances ensures consistent mounting.
• Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power handling.
• High Power Density: 0.8W total dissipation (0.05W per resistor) in a compact footprint.
• Automotive-Grade Alternatives: While not PPAP or Automotive-compliant, its performance parallels higher-tier industrial components.
• Non-RoHS Compliant: Suitable for legacy or specialized applications where RoHS exemptions apply.

GUS-SS8B-03-6202-JF Applications

• Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Control Systems: Stable resistance networks for PLCs and sensor interfaces.
• Test & Measurement Equipment: High-accuracy instrumentation requiring minimal drift.
• Power Management: Load sharing and current sensing in DC-DC converters.
• Legacy Electronics Repair: Direct replacement for non-RoHS compliant designs.

Conclusion of GUS-SS8B-03-6202-JF

The GUS-SS8B-03-6202-JF excels in applications demanding tight tolerance, low thermal drift, and compact integration. Its thin-film technology and SOIC gull-wing package offer a balance of performance and manufacturability, distinguishing it from thicker-film or less stable alternatives. While not suited for automotive use, it remains a cost-effective solution for industrial, medical, and precision electronics where reliability under thermal stress is critical.