TT Electronics/IRC

GUS-SS8B-03-7682-FF

GUS-SS8B-03-7682-FF Description

The GUS-SS8B-03-7682-FF from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin SOIC (Small Outline Integrated Circuit) package integrates 15 resistors with a 76.8K Ohm resistance value, offering 1% tolerance and a ±25ppm/°C temperature coefficient for exceptional stability. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. The gull-wing termination ensures secure surface-mount (SMD) assembly, while the compact 9.91mm x 5.99mm x 1.45mm footprint saves board space.

GUS-SS8B-03-7682-FF Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±1% tolerance) for signal conditioning and voltage division.
• Robust Power Handling: 0.8W total power rating with derated performance up to 125°C, ideal for power-sensitive designs.
• Stable Thermal Performance: ±25ppm/°C TCR minimizes resistance drift under temperature fluctuations.
• High Voltage Tolerance: Supports up to 100V, suitable for industrial and automotive-grade circuits (though not PPAP/AEC-Q200 certified).
• Compact SOIC Package: 16-pin gull-wing SMD design with 1.27mm pitch for easy PCB integration.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring leaded components.

GUS-SS8B-03-7682-FF Applications

• Analog Signal Processing: Precision dividers, DAC/ADC reference networks.
• Industrial Controls: PLCs, sensor interfaces, and instrumentation requiring stable resistance.
• Power Management: Voltage scaling and current-limiting circuits in power supplies.
• Test & Measurement Equipment: Calibration circuits and high-accuracy measurement systems.
• Aerospace & Defense: Non-RoHS compliance may align with certain military specs (verify suitability).

Conclusion of GUS-SS8B-03-7682-FF

The GUS-SS8B-03-7682-FF excels in applications demanding tight tolerance, thermal stability, and compact integration. Its thin-film construction and high-voltage capability distinguish it from generic thick-film networks, while the SOIC package ensures compatibility with automated assembly. Though not automotive-grade, its wide temperature range and low TCR make it a versatile choice for industrial, medical, and precision electronics. Engineers will appreciate its balance of performance, reliability, and space efficiency.