TT Electronics/IRC

GUS-SS8B-03-8251-GD

GUS-SS8B-03-8251-GD Description

The GUS-SS8B-03-8251-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC device integrates 15 resistors with a 8.25K Ohm resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. With a ±25ppm/°C temperature coefficient, it delivers exceptional stability across a wide operating temperature range of 70 to 125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for high-reliability designs. Packaged in a gull-wing SMD format, it offers easy surface-mount integration while maintaining a compact footprint (9.91mm x 5.99mm x 1.45mm).

GUS-SS8B-03-8251-GD Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±25ppm/°C) for sensitive analog/digital circuits.
• Robust Construction: SOIC package with gull-wing terminals ensures reliable soldering and mechanical durability.
• Optimized Power Handling: 0.8W total dissipation (0.05W per resistor) supports sustained operation at elevated temperatures.
• Wide Temperature Range: Operates reliably from 70°C to 125°C (derated power).
• Space-Efficient Design: Compact rectangular form factor (9.91mm length, 1.45mm height) ideal for dense PCB layouts.
• Non-Automotive/Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.

GUS-SS8B-03-8251-GD Applications

• Signal Conditioning: Precision voltage dividers and feedback networks in instrumentation.
• Medical Electronics: Stable resistance for patient monitoring and diagnostic equipment.
• Telecom Infrastructure: Impedance matching and termination in high-frequency circuits.
• Industrial Control Systems: Reliable performance in PLCs and sensor interfaces.
• Test & Measurement Equipment: Low-drift resistance for calibration and reference circuits.

Conclusion of GUS-SS8B-03-8251-GD

The GUS-SS8B-03-8251-GD excels in applications demanding high precision, thermal stability, and compact integration. Its thin-film technology, tight tolerance, and robust SOIC package make it a superior choice over thicker-film or less stable alternatives. While not RoHS-compliant, it remains ideal for industrial, medical, and telecom systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of performance, power handling, and space-saving design.