TT Electronics/IRC

GUS-SS8B-03-9761-JF

GUS-SS8B-03-9761-JF Description

The GUS-SS8B-03-9761-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. It features 15 resistors in a 16-pin SOIC package with a 9.76KΩ resistance value and a tight ±5% tolerance. The device operates within a wide temperature range of 70°C to 125°C (derated) and offers a ±25ppm/°C temperature coefficient, ensuring stability under thermal stress. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is suitable for demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-03-9761-JF Features

• Precision Thin Film Technology: Delivers low noise and high accuracy for sensitive analog/digital circuits.
• Compact SOIC Package: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D) for space-constrained designs.
• Robust Performance: 125°C maximum operating temperature and ±25ppm/°C TCR ensure reliability in harsh environments.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Surface-Mount Gull Wing Terminals: 1.27mm pitch enables high-density PCB layouts with reliable solder joints.
• Non-Automotive, Non-PPAP: Ideal for industrial, telecom, and instrumentation use where PPAP compliance isn’t required.

GUS-SS8B-03-9761-JF Applications

• Signal Conditioning: Precision voltage dividers in data acquisition systems.
• Bus Termination: Impedance matching in high-speed digital circuits (e.g., DDR memory interfaces).
• Industrial Controls: Stable resistor networks for PLCs and sensor interfaces.
• Telecom Equipment: Pull-up/down networks in communication modules.
• Test & Measurement: Calibration circuits requiring low TCR and tight tolerance.

Conclusion of GUS-SS8B-03-9761-JF

The GUS-SS8B-03-9761-JF excels in precision, power efficiency, and thermal stability, making it a superior choice for high-reliability electronics. Its thin-film construction, compact SOIC package, and BUS-oriented design provide distinct advantages over thicker-film or less stable alternatives. While not RoHS-compliant, it remains a go-to solution for industrial and telecom applications demanding consistent performance under thermal and electrical stress. Engineers will appreciate its balance of accuracy, power handling, and ease of integration in complex PCB assemblies.