TT Electronics/IRC

M8340101K4700GB

M8340101K4700GB Description

The M8340101K4700GB from TT Electronics/IRC is a high-performance 13-resistor thin film network designed for precision applications. Housed in a 14-pin ceramic DIP package, it offers a 470Ω resistance per element with a tight 2% tolerance and a low ±100ppm/°C temperature coefficient. Rated for 1.3W total power dissipation (0.1W per resistor) and operating up to 150°C, this component ensures reliability in demanding environments. Its through-hole pin termination and 2.54mm pitch facilitate easy PCB integration, while the ceramic case provides excellent thermal stability and durability. Compliant with EU RoHS and classified under EAR99, it is suitable for global supply chains.

M8340101K4701K4700GB Features

• Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy.
• Robust Ceramic DIP Package: Enhances thermal management and mechanical strength.
• Wide Temperature Range: Operates from 70°C to 150°C with derated power handling.
• High Voltage Rating: Supports up to 100V, ideal for industrial and instrumentation use.
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down applications.
• Compact Dimensions: 17.78mm (L) × 7.87mm (D) × 2.03mm (H) with a low 2.67mm seated height.

M8340101K4700GB Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Precision voltage dividers and bias networks.
• Bus Termination: Mitigates signal reflections in high-speed data lines (e.g., memory buses).
• Industrial Controls: Robust performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Stable resistance for calibration circuits.
• Aerospace & Defense: Reliable operation in harsh environments due to ceramic construction.

Conclusion of M8340101K4700GB

The M8340101K4700GB stands out for its precision, durability, and versatility, making it a superior choice for engineers requiring stable resistor networks in critical circuits. Its thin film technology, ceramic encapsulation, and wide operating range address challenges in industrial, automotive (non-PPAP), and high-reliability systems. Packaged in a tube for automated assembly, it combines ease of use with high-end performance, ensuring long-term reliability in diverse electronic designs.