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SIP-4701-01-2102-J
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SIP-4701-01-2102-J Description
SIP-4701-01-2102-J Description
The SIP-4701-01-2102-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 10-pin SIP (Single In-line Package) device integrates 9 resistors, each with a 21KΩ resistance value and a 5% tolerance, delivering a total power rating of 1.08W (0.12W per resistor). Encased in a ceramic package, it ensures excellent thermal stability and durability, with a temperature coefficient of ±100ppm/°C and an operational range of 70°C to 125°C (derated). Its through-hole mounting and pin termination provide reliable connectivity, while the 2.54mm terminal pitch ensures compatibility with standard PCB layouts.
SIP-4701-01-2102-J Features
- High Power Handling: 1.08W total power dissipation (0.12W per resistor) for robust performance in demanding circuits.
- Stable Thin-Film Technology: Delivers low noise and high precision with a ±100ppm/°C TCR, ideal for sensitive analog applications.
- Ceramic Case: Enhances thermal conductivity and mechanical strength, suitable for harsh environments.
- Wide Voltage Rating: Supports up to 100V, making it versatile for various voltage divider and pull-up/down applications.
- Compliance: EU RoHS compliant and EAR99 (ECCN), ensuring global regulatory adherence.
- Compact SIP Package: 25.35mm length, 1.78mm depth, and 3.3mm height for space-efficient designs.
SIP-4701-01-2102-J Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers, feedback networks, and sensor interfaces.
- Industrial Control Systems: Reliable performance in PLCs, motor drives, and power supplies.
- Test & Measurement Equipment: Stable resistance for calibration circuits and instrumentation.
- Telecommunications: Signal attenuation and impedance matching in RF modules.
- Automotive & Aerospace (non-automotive grade): Auxiliary circuits where ceramic robustness is critical.
Conclusion of SIP-4701-01-2102-J
The SIP-4701-01-2102-J stands out for its thin-film accuracy, ceramic durability, and high power density, making it a superior choice for engineers prioritizing thermal stability and long-term reliability. While not PPAP or automotive-qualified, its wide temperature range and compliance suit industrial, telecom, and precision electronics. For designs requiring consistent performance under thermal stress, this network offers an optimal balance of precision, power, and packaging efficiency.



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