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CSC06A0110K0GEK Description
CSC06A0110K0GEK Description
The CSC06A0110K0GEK from Vishay is a high-performance thick film resistor network designed for precision applications requiring stable resistance values and robust thermal performance. This 6-pin SIP (Single In-line Package) device integrates five 10KΩ resistors with a tight 2% tolerance and a ±100ppm/°C temperature coefficient, ensuring reliable operation across a wide temperature range (25°C to 150°C). The conformal coated case style enhances durability against environmental factors, making it suitable for harsh operating conditions. With a maximum operating temperature of 125°C and a power rating of 0.75W (3/4W), this network resistor delivers efficient power dissipation while maintaining electrical integrity.
CSC06A0110K0GEK Features
- Circuit Designator: BUS configuration for streamlined circuit integration.
- High Power Handling: 0.2W per resistor (0.75W total) with derating up to 150°C.
- Robust Construction: Conformal coating for moisture and contaminant resistance.
- Precision Performance: 10KΩ ±2% tolerance and ±100ppm/°C TCR for stable operation.
- Through-Hole Mounting: 6-pin SIP package with 2.54mm terminal pitch for easy PCB assembly.
- Compliance: EU RoHS compliant (with exemption) and EAR99 ECCN for global use.
- Voltage Rating: Supports up to 100V, suitable for low-to-medium voltage applications.
CSC06A0110K0GEK Applications
Ideal for industrial control systems, automotive electronics (non-automotive qualified), and power management circuits, this resistor network excels in:
- Voltage divider networks requiring matched resistance values.
- Signal conditioning in sensor interfaces and ADC/DAC circuits.
- Pull-up/pull-down resistor arrays in digital logic designs.
- Power supply feedback loops where stability and precision are critical.
Its conformal coating makes it particularly suited for humid or dusty environments, such as HVAC controls or outdoor instrumentation.
Conclusion of CSC06A0110K0GEK
The CSC06A0110K0GEK stands out for its combination of precision, power handling, and environmental resilience, offering engineers a reliable solution for complex circuit designs. Its thick film technology ensures long-term stability, while the SIP package simplifies assembly. While not PPAP or automotive-qualified, it remains a versatile choice for industrial, consumer, and telecom applications demanding consistent performance under varying thermal and electrical stresses.



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